| 摘要 |
<p>PURPOSE: A light emitting device, a manufacturing method thereof, and a light emitting package are provided to minimize the reduction of light absorption by preventing electrostatic damage through a capacitor on an LED chip. CONSTITUTION: A light emitting structure(110) comprises a first conductive semiconductor layer(112), a second conductive semiconductor layer(116) and an active layer(114). A first dielectric layer(132) is formed on a cavity. A second electrode layer(120) is formed on the first dielectric layer. A second dielectric layer(134) is formed on the light emitting structure of the upper side of the cavity. A first electrode(142) is formed on the second dielectric layer.</p> |
