发明名称 |
ANISOTROPIC CONDUCTIVE FILM |
摘要 |
<p>A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition.</p> |
申请公布号 |
KR20110036733(A) |
申请公布日期 |
2011.04.08 |
申请号 |
KR20117000554 |
申请日期 |
2009.04.09 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
YAMADA YASUNOBU;AKUTSU YASUSHI;MIYAUCHI KOUICHI |
分类号 |
C09J9/02;C09J7/02;C09J11/00;H01R4/04 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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