METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device allowing flip-chip connection without requiring underfill. SOLUTION: A surface of this semiconductor device 13 formed with a semiconductor circuit is covered with a protective film 8 excluding an electrode 7 and an electrode part. The semiconductor device includes: an insulation layer 5 formed by mask-printing an insulation material containing particles on the semiconductor device; an external connection terminal 3 electrically connected to the electrode 7 possessed by the semiconductor device through a wire 4 for rewiring formed on the insulation layer; and a surface protective film 6 covering areas other than the external connection terminal. COPYRIGHT: (C)2011,JPO&INPIT