| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To further reduce restrictions in a manufacturing process, with respect to a composite substrate structured by bonding a first substrate with a second substrate through an adhesion layer. <P>SOLUTION: A method for manufacturing a composite substrate 10 includes: a formation step of forming a structural element portion 31 on a front surface of a first substrate 12; a grinding step of fixing the first substrate 12 and grinding a back surface 13 of the first substrate 12; and a sticking step of sticking a second substrate 14 to the ground back surface 13 with an adhesion layer 16 composed of an adhesive. In such a manner, before forming the adhesion layer 16, the handling properties of which are affected by heating, and before grinding the first substrate, the strength of which is decreased by grinding, a process of forming the structural element portion 31, including a heating step, is performed. Furthermore, a piezoelectric substrate may be used as the first substrate 12, and a supporting substrate which supports the piezoelectric substrate may also be used as the second substrate 14. An electrode 18 for an acoustic wave device may also be formed on the front surface 11 of the first substrate 12 as the structural element portion 31. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
