| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device that makes a liquid temperature of molten solder to be uniform while a liquid surface of solder is kept to be smooth. SOLUTION: The soldering device which brings a printed circuit board into contact with the molten solder 3 to perform soldering is provided with a molten solder tank having a shape obtained by combining two elliptic cylinders and storing the molten solder and a laminar flow generating means having an impeller 11 which is disposed in the vicinity of a center of the molten solder tank and generates a flow in the molten solder 3 and a straightening member 12 which is arranged in the vicinity of the impeller 11 and has a plurality of through-holes, namely, channels, parallel to the liquid surface of the molten solder 3. The printed circuit board where electronic components are placed is brought into contact with a laminar flow in a horizontal direction of the molten solder 3, which is generated by pushing out molten solder 3 to the straightening member 12 with rotation of the impeller 11 and making the solder pass through the straightening member 12. COPYRIGHT: (C)2011,JPO&INPIT |
