| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of plating an electronic component in which an adhesive of a transporting tape does not remain on the surface of the electronic component when the electronic component is separated from the transporting tape after being subjected to plating. SOLUTION: The method of plating the electronic component includes: an adhesion step A of making the electronic component 15 adhere to a plurality of the transporting tapes 23 with the adhesive with first adhesion force; a heating and pressing step B of heating the transporting tape by a heater 24 and simultaneously making the electronic component adhere to the transporting tape with the first adhesion force by pressing the electronic component by a press means 25; and a plating layer forming step C of transporting the plurality of the transporting tapes to which a plurality of the electronic components adhere into a plating solution 17 in a plating bath 16, bringing the electronic component into contact with a power supply electrode 21 in the plating solution and continuously forming a plating layer on the electrode of the electronic component. After the plating layer forming step C, an adhesion force reducing step D of reducing the adhesion force between the transporting tapes and the electronic components to second adhesion force lower than the first adhesion force is included. COPYRIGHT: (C)2011,JPO&INPIT
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