| 发明名称 |
CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THEREOF |
| 摘要 |
A ceramic wiring board comprises a ceramic substrate and a copper layer formed on the ceramic substrate. The average copper grain radius in the copper layer is approximately equal to or larger than 10 μm.
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| 申请公布号 |
US2011079418(A1) |
申请公布日期 |
2011.04.07 |
| 申请号 |
US20100896322 |
申请日期 |
2010.10.01 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
FURUICHI WATARU;HONDA HIROKAZU |
| 分类号 |
H05K1/09;C23C14/34;H05K3/16 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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