| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board fault correcting method for correcting a disconnection of high density and fine pattern with a low temperature process. SOLUTION: A wettability adjusting layer 5 using a material that is changed in wettability with irradiation of light is formed within an exposed surface region of a circuit board 1 including a disconnection point D of the wiring 3 formed on the circuit board 1. In the next second step, the light is radiated to the part corresponding to the disconnection point D in the wettability adjusting layer 5 or the other part. Accordingly, the wettability for an electrode forming liquid at the part corresponding to the disconnection point in the wettability adjusting layer 5 is set higher than that in the other part. Thereafter, the electrode forming liquid is supplied and dried up on the wettability adjusting layer 5 corresponding to the disconnection point D. Accordingly, a corrected electrode pattern 7 can be formed by drying the electrode forming liquid at the disconnection point D. COPYRIGHT: (C)2011,JPO&INPIT |
