发明名称 ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD OF SAME
摘要 Disclosed are an acoustic wave device and manufacturing method of the same for reducing temperature dependency for the frequency of an acoustic wave device, and reducing variation in TCF during manufacture of acoustic wave devices. A manufacturing method of an acoustic wave device includes a first film formation step (S10) for forming a silicon oxide film; a measurement step (S12) for measuring a value related to stretching vibration of Si-O bonds of the silicon oxide film; and a second film formation step (S18) for forming a silicon oxide film under conditions used in the first film formation step (S10) on a substrate when the value is within a target range.
申请公布号 WO2011040179(A1) 申请公布日期 2011.04.07
申请号 WO2010JP65099 申请日期 2010.09.03
申请人 TAIYO YUDEN CO.,LTD.;MATSUDA, SATORU;MATSUDA, TAKASHI;MIURA, MICHIO 发明人 MATSUDA, SATORU;MATSUDA, TAKASHI;MIURA, MICHIO
分类号 H03H3/08;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H01L41/23;H03H9/145;H03H9/64 主分类号 H03H3/08
代理机构 代理人
主权项
地址