发明名称 |
INTEGRATED CIRCUIT CHIP AND METHOD OF MANUFACTURING THE SAME AND FLIP CHIP PACKAGE HAVING THE INTEGRATED CHIP AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PURPOSE: An integrated circuit chip, integrated circuit chip manufacturing method, flip chip package with the integrated circuit chip and flip chip package manufacturing method are provided to separate a second bump structure from the central line of a wiring line as much as a fixed distance, thereby preventing stress from being concentrated on the wiring line. CONSTITUTION: An integrated circuit structure comprises a first area with a wiring line and a second area without a wiring line. The integrated circuit structure comprises a plurality of conductive structures and a wiring line(116). An electrode pad comprises a first electrode pad and a second electrode pad(114b). A passivation layer pattern comprises a first opening and a second opening and is arranged on the electrode pad. A bump structure comprises a first bump structure and a second bump structure(130). |
申请公布号 |
KR20110036354(A) |
申请公布日期 |
2011.04.07 |
申请号 |
KR20090093968 |
申请日期 |
2009.10.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, JIN WOO;AHN, EUN CHUL;SHIN, DONG KIL;KANG, SUN WON;LEE, JONG HO |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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