| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling structure excellent in cooling efficiency for semiconductor elements. <P>SOLUTION: The semiconductor cooling structure 1 includes a semiconductor module incorporating a semiconductor element 21, and a cooling pipe disposed in close contact with the semiconductor module. The cooling pipe 3 has a coolant flow passage 32 inside, and includes an intermediate plate 34 partitioning the coolant flow passage into a first flow passage 321 and a second flow passage 322 in a cooling surface normal direction X. The intermediate plate has a communication part 341, making the first flow passage communicate with second flow passage, at both ends in a cooling surface width direction Z. The first flow passage and second flow passage are provided with inclined fins 4 formed obliquely to a coolant flow direction Y, respectively, and the inclined fins of the first flow passage and the inclined fins of the second flow passage are opposite in inclination direction. The first flow passage and second flow passage each have partition plates 5, blocking the linear flow of a cooling medium in the coolant flow direction Y, formed at flow passage ends 323 in an element arrangement area V. The cooling medium flows alternately to the first flow passage and second flow passage through the communication part. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
