| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus including a substrate mounted with a heating element, the substrate being mounted on a heat sink via heat transfer grease so that heat can be dissipated from the substrate to the heat sink via the heat transfer grease, in which the substrate can be fixed to the heat sink without screwing to the heat sink. SOLUTION: The electronic apparatus includes the substrate 10 that is provided with the heating element 20 on its surface 11, and the heat sink 30. The substrate 10 is mounted on the heat sink 30 with the backside 12 of the substrate 10 facing the heat sink 30, and a heat transfer grease 40 is disposed in a gap where the backside 12 of the substrate 10 and the heat sink 30 face each other. The substrate 10 and the heat sink 30 are bonded by adhesives 50 that is located in the outer periphery ends 13 of the substrate 10. COPYRIGHT: (C)2011,JPO&INPIT |
