发明名称 |
Low Stress Photo-Sensitive Resin with Sponge-Like Structure and Devices Manufactured Employing Same |
摘要 |
System and method for forming a structure including a MEMS device structure. In order to prevent warpage of a substrate arising from curing process for a sacrificial material (such as a photoresist), and from subsequent high temperature process steps, an improved sacrificial material comprises (i) a polymer and (ii) a foaming agent or special function group. The structure can be formed by forming a trench in a substrate and filling the trench with a sacrificial material. The sacrificial material includes (i) a polymer and (ii) a foaming agent or special function group. After further process steps are completed, the sacrificial material is removed from the trench.
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申请公布号 |
US2011081740(A1) |
申请公布日期 |
2011.04.07 |
申请号 |
US20100892190 |
申请日期 |
2010.09.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI SHANG-YING;CHENG CHUN-REN;LEE JIOU-KANG;PENG JUNG-HUEI;WU TING-HAU |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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