发明名称 |
ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD |
摘要 |
An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
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申请公布号 |
US2011081544(A1) |
申请公布日期 |
2011.04.07 |
申请号 |
US20100960819 |
申请日期 |
2010.12.06 |
申请人 |
ASAI TAKAHIRO;MISUMI KOICHI;IMAI HIROFUMI |
发明人 |
ASAI TAKAHIRO;MISUMI KOICHI;IMAI HIROFUMI |
分类号 |
C09J133/24;B29C41/00;B32B27/28 |
主分类号 |
C09J133/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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