| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board and its manufacturing method, which allow the thickness of multilayer printed circuit board to be decreased, its manufacturing steps to be reduced, and productive efficiency to be increased. <P>SOLUTION: This multilayer printed circuit board includes: a buildup layer (108) including many circuit layers and many insulating layers; an insulating resin layer (101) formed in the outermost layer of the circuit layers of one surface of the buildup layer (108) printed with bumps; and a solder resist layer (112) formed in the outermost layer on the other surface of the buildup layer (108). In the multilayer printed circuit board, the buildup layer (108) on the other surface of the insulating resin layer (101) printed with the bumps on one surface, and the solder resist layer (112) are laminated in order. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
