发明名称 KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION
摘要 The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor.
申请公布号 US2011079929(A1) 申请公布日期 2011.04.07
申请号 US20100898897 申请日期 2010.10.06
申请人 NITTO DENKO CORPORATION 发明人 MATSUDA HIROKAZU;AKAZAWA KOJI;FUJIOKA KAZUYA
分类号 H01L23/28;C09K11/02 主分类号 H01L23/28
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