发明名称 MULTICHAMBER SPLIT PROCESSES FOR LED MANUFACTURING
摘要 Embodiments described herein generally relate to methods for forming Group III-V materials by metal-organic chemical vapor deposition (MOCVD) processes and/or hydride vapor phase epitaxial (HVPE) processes. In one embodiment, deposition of a group III1-N layer on a substrate is performed in a first chamber, deposition of a group III2-N layer on the substrate is performed in a second chamber, and deposition of a group III3-N layer on the substrate is performed in a chamber different from the chamber where the group III2-N layer is deposited. Between the group III2-N layer deposition and the group III3-N layer deposition, one or more surface treatment processes are performed on the substrate to reduce non-radiative recombination at the interface and improve overall electroluminescence of the produced structure.
申请公布号 US2011081771(A1) 申请公布日期 2011.04.07
申请号 US20100897429 申请日期 2010.10.04
申请人 APPLIED MATERIALS, INC. 发明人 SU JIE
分类号 H01L21/20 主分类号 H01L21/20
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