BONDING CAPILLARY

摘要

Disclosed is a bonding capillary which has: a first cylindrical section, which is mechanically fixed to a bonding apparatus; a conical section provided on the first cylindrical section side where bonding is performed; and a bottleneck section provided on the conical section side where the bonding is performed. An attenuating section is provided between the conical section and the bottleneck section, said attenuating section having a diameter which is smaller than the diameter of the conical section end portion on the side where the bonding is performed and is larger than the diameter of the bottleneck section end portion on the side opposite to the side where the bonding is performed. In wire bonding using a copper wire, the bonding capillary suppresses generation of mechanical breakage of an aluminum electrode and a semiconductor element in a state wherein bonding strength is ensured.