SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, OPTICAL MODULE AND CAMERA MODULE

摘要

Disclosed are a substrate for mounting an element, which is capable of suppressing diffused light reflection; a semiconductor module; an optical module; and a camera module. Specifically disclosed is a semiconductor module, wherein a lower wiring board (10) that is provided with an semiconductor element (11) and an upper wiring board (20) that has an opening (21) at the position corresponding to the semiconductor element (11) and has a mounting region for a component to be mounted around the opening (21) are electrically connected with each other at positions around the semiconductor element (11) with a plurality of solder balls (30). From a first main surface (20a) to a second main surface (20b) of the upper wiring board (20) via the end face (20c) of the opening (21) is covered with a black resin (26), and the surface of the resin (26) is provided with recesses and projections.