<p>Disclosed is a circuit board in which a chip component is mounted on a core circuit board formed with an electrode pattern, and a resin layer is provided on top of the core circuit board, and in which the strength of adhesion between the core circuit board and the resin layer is improved. An electrode pattern having a large surface area and including an electrode pattern for mounting is formed on a first main surface of the core circuit board. The electrode pattern for mounting is formed by partitioning part of the electrode pattern, using a linear resist pattern.</p>
