| 摘要 |
<p>Electronic components of different sizes are simultaneously mounted with high precision. The disclosed film has a two-layer configuration of a first resin layer (11) having a tack strength of at least 200 kPa, and a second resin layer (12) containing conductive particles. By means of electronic components being installed in the first resin layer (11), use on an IC, FPC, and SMD becomes possible, and simultaneous mounting becomes possible.</p> |
| 申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION;FUKAYA, TATSUROU;MATSUSHIMA, TAKAYUKI;YAMAMOTO JUN;AIZAKI, RYOTA;KUDO, KATSUYA;FURUTA, KAZUTAKA |
发明人 |
FUKAYA, TATSUROU;MATSUSHIMA, TAKAYUKI;YAMAMOTO JUN;AIZAKI, RYOTA;KUDO, KATSUYA;FURUTA, KAZUTAKA |
