| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable orientation of a tip of a probe element without changing the position of a probe card. <P>SOLUTION: A probe card assembly 500 includes: a probe card 502; a space converter having a contact structure (probe element) 524, which is a space converter 506; and an interposer 504 disposed between the space converter and the probe card. Mechanisms 532, 536, 538, 546 are disclosed, which are suitable for determining the degree of adjustment by "stacking" the space converter and the interposer, and by adjusting orientation of the space converter. A probe is allowed to abut on many die sites on a semiconductor wafer 508 easily by using the disclosed technique, and the probe element can be arrayed to optimize probe abutment on the whole wafer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
