| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which can be adapted to a thin film and can adjust an amount of resin in accordance with a circuit pattern, a substrate having the prepreg, and a semiconductor device. SOLUTION: The prepreg 10 has a fiber base material 1 constituted of glass fibers, a first resin layer 21 located at one surface side of the fiber base material 1, and a second resin layer 22 located at the other surface side of the fiber base material 1. The first resin layer 21 is thicker than the second resin layer 22. At least one of a resin material 2 constituting the first resin layer 21 and a resin material 2 constituting the second resin layer 22 is composed of a resin composition containing an inorganic filler and a coupling agent. COPYRIGHT: (C)2011,JPO&INPIT |
