| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board that has superior breakdown voltage characteristics and is superior in adhesion to an insulating layer. SOLUTION: The printed wiring board having interconnects 3 and 4 made of conductors includes an insulating layer 2, the interconnects formed on the insulating layer 2 and composed of the conductors, and solder resist layers 6 and 7 provided covering the interconnects 3 and 4. The printed wiring board satisfies an expression (1) of (T+10)×d<SP>2</SP>/(ε+10)≥8, wherein Tμm is a film thickness of the solder resist layers 6 and 7,εis relative permittivity of solder resist forming the solder resist layers 6 and 7, and d (mm) is a shortest distance of a distance between the interconnects 3 and 4 in a printed wiring board surface direction of the interconnects or a distance between ends of the interconnects in the printed wiring board surface direction and a printed wiring board end. COPYRIGHT: (C)2011,JPO&INPIT
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