发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board such that a conductor layer bonded in a groove on a side surface of an insulating base has high reliability of connection with an external electric circuit via a conductive connecting material. SOLUTION: The wiring board 10 includes: the insulating base 1 which has a mounting part 2 for an electronic component 6 on a main surface and has a vertically extending groove 4 on an outer side surface; a connection pad 3 which is formed at the mounting part 2 and to which the electronic component 6 is electrically connected; and a conductor layer 5 which is bonded to an inner side surface of the groove 4 and electrically connected to the connection pad 3, the conductor layer 5 being connected to the external electric circuit via the conductive connecting material. The groove 4 has a concavity 4a formed reaching both width-directional ends of the groove 4, and the conductor layer 5 is bonded along the concavity 4a to have a partially concave surface. The area of connection with the conductive connecting material increases because of the concavity 4a, so the reliability of connection can be increased. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011071373(A) 申请公布日期 2011.04.07
申请号 JP20090221924 申请日期 2009.09.28
申请人 KYOCERA CORP 发明人 WAKASAKI AKIRA;KAMASE YUSHI
分类号 H01L23/12 主分类号 H01L23/12
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