| 摘要 |
The present invention provides a low-lead copper alloy, which includes 0.05 to 0.3 wt % of lead, 0.3 to 0.8 wt % of aluminum, 0.01 to 3 wt % of bismuth, 1 to 4 wt % of silicon, 0.1 to 1 wt % of tin, and more than 93.6% of copper and zinc, wherein copper is in an amount ranging from 61 to 78 wt %. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions.
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