| 摘要 |
<p>Provided is a high voltage insulation circuit board to be used in power devices such as power converters, which can for example be power semiconductor devices or inverter modules, wherein concentration of electric fields at the end sections of a wiring pattern is reduced, partial discharging is minimized, and the reliability thereof is high. The insulation circuit board comprises a metal base substrate and a wiring pattern that is formed on at least one of the faces of the metal base substrate with an insulation layer disposed therebetween, and the insulation circuit board is characterized in having, arranged between two adjacent wiring patterns having a potential difference among the aforementioned wiring patterns, one or more wiring patterns or conductors that are in contact with the aforementioned insulation layer and that have potential that is in between the aforementioned potential difference between the two adjacent wiring patterns. Concentration of electric fields is thereby reduced at the end sections of the wiring pattern, to where high voltages are applied, improving the partial-discharge-resistant characteristic of the insulation circuit board.</p> |
