| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component mounting device which removes dust and foreign matter sticking on electronic components in accordance with types of the electronic components when the electronic components are sucked by a suction nozzle. <P>SOLUTION: The component mounting device includes an air jetting means for supplying compressed air from a positive pressure supply source to a nozzle hole 35a of the suction nozzle 35 and jetting the compressed air from the nozzle hole 35a of the suction nozzle 35 toward an upper surface of an electronic component P stored in an electronic component storage part before sucking the electronic component P by the suction nozzle 35, and further includes a vertical position-adjusting means for adjusting the position of the suction nozzle in a vertical direction in accordance with the type of the electronic component sucked by the suction nozzle. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
