| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a wafer, wherein the method reduces chipping occurring to an annular projection and efficiently discharges a processing liquid, such as an etchant and a resist liquid, to the outside of the wafer. SOLUTION: The method of processing the wafer having, on a top surface, a device region where a plurality of devices are formed and an outer peripheral surplus region surrounding the device region includes: a wafer grinding step of grinding a region corresponding to the device region of the wafer to form a circular recess on a back surface, and also forming the annular projection surrounding the circular recess; and an annular projection cutting step of rotating a holding means holding the wafer while rotating a cutting blade having an axis of rotation parallel with a holding surface, moving the holding means and grinding blade relatively to cut the annular projection, and thereby forming a slope which is inclined from an upper surface inner peripheral side of the annular projection toward the wafer center of the circular recess. COPYRIGHT: (C)2011,JPO&INPIT |
