| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition apparatus capable of forming a desired coating film pattern on a substrate while conveying the substrate during the film deposition. SOLUTION: In the film deposition method in which a substrate and a mask member opposing aperture parts are conveyed in the direction substantially orthogonal to the alignment direction of the aperture parts while scattering a vapor deposition material from the aperture parts of a line-shaped vapor deposition source having the plurality of aperture parts aligned parallel to each other, the vapor deposition material is vapor-deposited on the substrate to laminate a thin film. A portion to be vapor-deposited of the substrate is preliminarily heated by using a heating means adjacent to the vapor deposition source and provided on the side opposite to the moving direction of the substrate and the mask member by the conveyance, and then, the vapor deposition material is vapor-deposited on the portion to be vapor-deposited. COPYRIGHT: (C)2011,JPO&INPIT
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