| 摘要 |
A universal test fixture for testing and characterization of high-power flange-packaged RF and microwave transistors and diodes includes a precision-machined heat sink having a built-in center cavity with a finger catch on either side of the cavity which uses a plurality of matching modules that are installed in the center cavity and designed as transistor or diode carrier modules to provide mounting for the high-power packaged RF and microwave devices in a wide variety of flange type packages, an adjustable clamping structure connected to a movable arm, and a plurality of non-conductive high temperature pressure clamps. Each carrier module is made of a gold-plated rectangular aluminum block having a center cavity that is machined to the package outline. A non-conductive black-anodized high-temperature resistant pressure clamp machined to the package outline holds the packaged device in the carrier module. When clamped down using the clamping structure, the pressure clamp holds the package leads on a printed circuit board ensuring excellent electrical contact between package leads and circuit traces and surrounding ground planes, obviating soldering and desoldering the leads to the circuit board. The pressure clamp also produces pressure along the device package to hold the packaged device to the carrier module which houses the device and which itself is bolted to the heat sink resulting in excellent thermal contact under the device.
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