| 摘要 |
A method for making a thin film having a metallic pattern layer includes covering a release layer on the surface of a thin film substrate to leave a blank area of a predetermined pattern in the release layer, covering a metal layer on the release layer and the blank area, covering the metal layer with an adhesive layer, adhering a substrate-based thin film to the adhesive layer, and removing the substrate-based thin film to remove the part of the metal layer outside said blank area and the release layer together with the adhesive layer and the substrate-based thin film from the thin film substrate so that a metallic pattern layer is left on the thin film substrate for RFID (radio frequency identification) system, antennas of wireless transmission system, flexible printed circuit boards or chip on film (chip on flex) applications.
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