发明名称 |
HEATING CURING TYPE CONDUCTIVE PASTE COMPOSITION, ELECTRODE USING CONDUCTIVE PASTE COMPOSITION, AND METHOD OF FORMING WIRING PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To provide a heating curing type conductive paste composition which has excellent printing property as well as high conductivity and good solder wettability. SOLUTION: The heating curing type conductive paste composition contains silver powders, a heating curing type component, a curing agent, and a solvent. It contains flake-like silver powders and spherical silver powders attached with a surface treating agent, as the silver powders. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011071057(A) |
申请公布日期 |
2011.04.07 |
申请号 |
JP20090223227 |
申请日期 |
2009.09.28 |
申请人 |
KYOTO ELEX KK |
发明人 |
HINOTSU TAKASHI;OCHIAI NOBUO;OGI KOZO;NAKAYAMA YUTAKA |
分类号 |
H01B1/22;H01B1/00;H01B5/14;H01B13/00;H05K1/09;H05K3/12 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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