发明名称 HEATING CURING TYPE CONDUCTIVE PASTE COMPOSITION, ELECTRODE USING CONDUCTIVE PASTE COMPOSITION, AND METHOD OF FORMING WIRING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a heating curing type conductive paste composition which has excellent printing property as well as high conductivity and good solder wettability. SOLUTION: The heating curing type conductive paste composition contains silver powders, a heating curing type component, a curing agent, and a solvent. It contains flake-like silver powders and spherical silver powders attached with a surface treating agent, as the silver powders. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011071057(A) 申请公布日期 2011.04.07
申请号 JP20090223227 申请日期 2009.09.28
申请人 KYOTO ELEX KK 发明人 HINOTSU TAKASHI;OCHIAI NOBUO;OGI KOZO;NAKAYAMA YUTAKA
分类号 H01B1/22;H01B1/00;H01B5/14;H01B13/00;H05K1/09;H05K3/12 主分类号 H01B1/22
代理机构 代理人
主权项
地址