| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape excelling in productivity of the wafer processing tape, and preventing occurrence of trouble where a double die is generated or a semiconductor chip cannot be picked up in a pickup process. SOLUTION: In this wafer processing tape 10, strength ratio (D/C) is≤0.8, when tearing strength of a right angled tearing test piece 100 is denoted by C in a test method of a right angled tearing test piece shown in JIS K7128-3 "Plastic-Film and sheet-Determination of tear resistance-Part 3: Right angled tear method" using an adhesive film 12 as a right angled tearing test piece, and tearing strength of a right angled tearing test piece 110 in the case where a cut part 115 of a length of about 1 mm from a tip of the right angle part of the right angled tearing test piece 100 is included on a center line passing through the tip of the right angle part is D. In addition, in measurement of elongation percentage by the second test piece in JIS K7113, the elongation percentage of an adhesive layer 13 being the second test piece 120 is≥150%. COPYRIGHT: (C)2011,JPO&INPIT |
