| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such the problem that when a clad material is used as the wiring material of a solar cell as it is, characteristics deteriorate owing to oxidation of an exposed low thermal expansion material during solder heating etc., and a clad structure peels owing to a difference in coefficient of thermal expansion between the low thermal expansion material and copper, and further such the problem that although solder on the opposite side from a junction surface is fused during the solder heating, the solder is repelled by the exposed low thermal expansion material and thereby does not sufficiently gather on the junction surface of a solar cell element. <P>SOLUTION: The solar cell module having the wiring material joined to the principal surface of a solar cell element has a clad structure in which the wiring material includes a low thermal expansion material as a core material, and the core material is sandwiched between copper materials, and the solder is formed over the entire outer peripheral surface of the wiring material. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
