| 摘要 |
PROBLEM TO BE SOLVED: To enable an infrared sensor module to perform highly precisely positioning of a lens and an infrared sensor and also to cope with surface mounting. SOLUTION: The infrared sensor module 1 includes a circuit substrate 2, an infrared sensor 3 receiving an infrared signal, a lens 5 imaging the infrared signal on the infrared sensor 3, a lens pedestal 6 supporting the lens 5, and a metal case 7 housing the infrared sensor 3. The infrared sensor 3 is disposed in the circuit substrate 2. The lens 5 is supported by the lens pedestal 6 and disposed above the infrared sensor 3. The lens pedestal 6 is mounted on the circuit substrate 2 so that an aperture 60 is positioned between the infrared sensor 3 and the lens 5. The metal case 7 is mounted on the circuit substrate 2 so that an incident window 70 aligns with the lens 5. The metal case 7, the lens 5 and the circuit substrate 2 are connected by a sealing resin 17 to hollow-seal the infrared sensor 3. COPYRIGHT: (C)2011,JPO&INPIT |
