摘要 |
An improved method for post-texturing cleaning, surface conditioning, and rinsing silicon wafers or similar surfaces, with particular, although not exclusive, applicability in photovoltaic applications which includes cleaning the surfaces sequentially with dilute HF/HCI and dilute oxidizing rinse, particularly following texturing with concentrated HF/HNO3 and/or KOH. The method allows for the recycling of the oxidizing rinse in t dilute HF/HCI and other upstream rinse steps. |
申请人 |
MT SYSTEMS, INC.;REINHARDT, KAREN, A.;HERRERA, PYTHIAS, V.;VUKOSAV, THOMAS, M. |
发明人 |
REINHARDT, KAREN, A.;HERRERA, PYTHIAS, V.;VUKOSAV, THOMAS, M. |