Method for separating microelectronic or micromechanical components i.e. chips, involves producing separating trench in output component, and expanding film for breaking output component along separating trench

摘要

The method involves attaching an expandable film (1) at a rear side (2) of an output component (3) by lamination. A separating trench is produced in the output component by cutting the component using laser. The film is expanded for breaking the output component along the separating trench. Pressure is exerted on a rear side (5) of the film against the separating trench, where the rear side of the film is turned towards the output component. Inert gas is supplied for controlling material emission associated with generation of the separating trench.