| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film with a dicing sheet having a pressure-sensitive adhesive layer on a base material and also having a peelable adhesive film on the pressure-sensitive adhesive layer, which has an excellent peeling property when peeling a semiconductor chip obtained by dicing and the adhesive film together without impairing the holding power even during dicing a thin semiconductor wafer, and a method for manufacturing the same. <P>SOLUTION: This adhesive film with a dicing sheet is formed by sequentially laminating a pressure-sensitive adhesive layer and an adhesive layer on a base material, in which the intensity of an Si-Kα ray on at least one region on a surface of the pressure-sensitive adhesive layer to be pasted onto the adhesive layer is 0.01 to 100 kcps. <P>COPYRIGHT: (C)2011,JPO&INPIT |
