| 摘要 |
PROBLEM TO BE SOLVED: To suppress the curvature of a head substrate by using an epoxy based resin as a sealing body. SOLUTION: A thermal print head 10 has a heat radiating plate 20, and the head substrate 30 including a support substrate 32 composed of ceramic, a circuit substrate 50, a drive IC 60, a sealing body 66, and a ceramic plate 70. The head substrate 30 and the circuit substrate 50 are arranged on the upper face of the heat radiating plate 20. The drive IC 60 is mounted to the upper face close to the head substrate 30 of the circuit substrate 50 and is sealed to the head substrate 30 and the circuit substrate 50 by the sealing body 66 composed of the epoxy based resin. The circuit substrate 50 has a flexible substrate 51 on which a first connecting circuit 52 is formed and a rigid substrate 53 on which a second connecting circuit 54 electrically connected to the first connecting circuit 52 is formed. The ceramic plate 70 is affixed to the lower face of the flexible substrate 51. COPYRIGHT: (C)2011,JPO&INPIT
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