发明名称 METHOD OF FORMING CONDUCTIVE PATTERN
摘要 PROBLEM TO BE SOLVED: To form a conductive pattern having high definition, high migration resistance, and high corrosion resistance. SOLUTION: A conductive material precursor includes, sequentially on a substrate, at least: a physical phenomenon nucleus layer containing at least one selected from polyethylenimine, polyarylamine and polyvinylamine; and a silver halide emulsion layer. The method of forming a conductive pattern includes subjecting the conductive material precursor sequentially to (A) image-like exposure, (B) diffusion/transfer/development processing, (C) provision of a compound adsorbed to a silver image part, (D) electrodeless plating treatment of a metal other than silver to a non-image part, and (E) separation of the silver image part. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011071367(A) 申请公布日期 2011.04.07
申请号 JP20090221876 申请日期 2009.09.28
申请人 MITSUBISHI PAPER MILLS LTD 发明人 SUNAKAWA TOMOHIDE
分类号 H05K3/18;C23C18/31;G03C8/06;H01B13/00 主分类号 H05K3/18
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