发明名称 FLAW INSPECTION METHOD AND FLAW INSPECTION SYSTEM
摘要 PROBLEM TO BE SOLVED: To solve the problem wherein the arranging constitution of line sensors in a plurality of directions is effective in order to maximize the effect of signal addition in a flaw inspection system but, since pixel shift is produced by the height variation in the vertical direction of a wafer produced during inspection, it becomes difficult to precisely add the mutual scattered light signals of the same coordinates. SOLUTION: In the flaw inspection system, the magnitude of the pixel shift is detected by performing pattern matching using a Haze signal at every detector and the correction of coordinates is performed to enable the precise addition of the mutual scattered light signals of the same coordinates. Alternatively, the magnitude of the height variation of the wafer is detected by either one of means for detecting the positional shift of an illumination region and the incident position shift of regular reflected light and the correction of the coordinates is performed on the basis of the detected value to precisely add the mutual scattered light signals of the same coordinates. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011069659(A) 申请公布日期 2011.04.07
申请号 JP20090219264 申请日期 2009.09.24
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MARUYAMA SHIGENOBU;HONDA TOSHIFUMI;NAKAO TOSHIYUKI;URANO YUTA
分类号 G01N21/956;H01L21/66 主分类号 G01N21/956
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