CIRCUIT SUBSTRATE AND PROCESS FOR PRODUCTION THEREOF

摘要

Provided is a circuit substrate comprising a laminate containing a built-in electronic part, the laminate being formed by stacking insulation films of a flexible material, which will not cause circuit disconnection between the electronic part and the electrically connected terminal electrode. The laminate (12) is constituted of a stack of flexible sheets of a flexible material. The connection terminals (18) are provided in the laminate (12). The electronic part (20) is built into the laminate (12). The connecting conductor (30) which connects the electronic part (20) electrically with the connecting terminals (18) is constituted of an assemblage of metal particles.