MANUFACTURING METHOD OF SUBSTRATE FOR FLIP CHIP AND SUBSTRATE FOR FLIP CHIP USING THE SAME
摘要
<p>PURPOSE: A method for manufacturing a substrate for a flip chip is provided to eliminate height and location ununiformity using a metal post and a solder cap, thereby forming a metal post with high mounting reliability on a semiconductor substrate. CONSTITUTION: A base substrate comprises a conductive pad. A solder resist layer(3) includes a first opening exposing the conductive pad. A dry film includes a second opening connected to the first opening on the solder resist layer. A metal post(6) is formed on a part of the first and second openings. The second opening is filled with a solder paste. The filled solder paste is reflowed to form a solder cap(7b).</p>
