| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device which performs wire bonding using wires composed of copper. <P>SOLUTION: The device has a structure where one end (broad width part 30b) of wire 30 composed of copper is bonded onto a pad (electrode pad) 11 formed on a principal surface (first principal surface) 10a of a semiconductor chip 10 possessed by the semiconductor device via a bump 31. The bump 31 is composed of gold which is a metal material having lower hardness than copper, and a width Wc of the bump 31 is narrower than a width Wb of the broad width part 30b of the wires 30. <P>COPYRIGHT: (C)2011,JPO&INPIT |
