| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of achieving miniaturization, light weight, and thin thickness. SOLUTION: The method is provided for manufacturing the circuit board 1 by placing a built-up layer 20 consisting of a prepreg sheet on a core layer 10. A wiring pattern (first wiring pattern) 21 is formed on one surface of the built-up layer 20 in a non-cured state, and the built-up layer 20 is placed on the core layer 10 such that the wiring pattern (first wiring pattern) 21 is on the side of the core layer 10. By applying an isotropic pressure to the layers while applying heat thereto, the built-up layer 20 is pressed onto the core layer 10 so that the wiring pattern (first wiring pattern) 21 is contained within the built-up layer 20. COPYRIGHT: (C)2011,JPO&INPIT |
