| 摘要 |
PROBLEM TO BE SOLVED: To provide a pad arrangement structure of a driver IC chip for a liquid-crystal display device which disposes dummy power pads and dummy ground pads in corners of the driver IC chip and connects those to main power pads and main ground pads, respectively, by metal lines in a chip-on-film (COF) package. SOLUTION: By adopting the pad arrangement structure of the driver IC chip, it is possible to reduce the resistance of power supply lines and ground lines, to minimize a power dip of a block located far away from the main power pads and the main ground pads, and to prevent a failure in power application which may occur due to a decrease of adhesive strength at a specific position by dispersing adhesion positions of the power pads and the ground pads. COPYRIGHT: (C)2011,JPO&INPIT
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