| 发明名称 |
DUAL METAL INTERCONNECTS FOR IMPROVED GAP-FILL, RELIABILITY, AND REDUCED CAPACITANCE |
| 摘要 |
Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.
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| 申请公布号 |
US2011079910(A1) |
申请公布日期 |
2011.04.07 |
| 申请号 |
US20100967865 |
申请日期 |
2010.12.14 |
| 申请人 |
O'BRIEN KEVIN;AKOLKAR ROHAN;INDUKURI TEJASWI;FAJARDO ARNEL M |
发明人 |
O'BRIEN KEVIN;AKOLKAR ROHAN;INDUKURI TEJASWI;FAJARDO ARNEL M. |
| 分类号 |
H01L23/532 |
主分类号 |
H01L23/532 |
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