HIGHLY RELIABLE LEAD FRAME FOR AN LED PACKAGE

摘要

The present invention relates to a highly reliable lead frame for an LED package, wherein the lead frame comprises at least a pair of electrode plates for supplying power to an LED chip; a chip-bonding unit to which the LED chip is bonded; and a structured deterioration-resistant reflector having a shape which surrounds the LED chip, wherein the reflector has a portion inclined toward the LED chip so as to reflect light emitted by the LED chip. Thus, the present invention provides a highly reliable lead frame in which the deterioration of the reflector is prevented and therefore the luminous intensity thereof is ensured even over a long period of use, and the reflectivity of the reflector can be improved.