| 摘要 |
<p>A heat conveying structure for an electronic device is provided with: an evaporating section that has a chamber structure with first fins erected therein, connects thermally to the aforementioned electronic device, evaporates liquid coolant on the surface of the aforementioned first fins to change the liquid coolant to vapor coolant, and sends out liquid coolant existing at the vicinity of the aforementioned first fins along with the aforementioned vapor coolant, as gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, connects thermally to a radiator furnished outside the aforementioned electronic device, and changes the aforementioned gas-liquid two-phase flow coolant in contact with the aforementioned second fins into liquid coolant; a vapor pipe that connects the aforementioned evaporating section and the aforementioned condensing section, and moves the aforementioned gas-liquid two-phase flow coolant sent out from the aforementioned evaporating section to the aforementioned condensing section; and a liquid pipe that connects the aforementioned evaporating section and the aforementioned condensing section, and moves the aforementioned liquid coolant from the aforementioned condensing section to the aforementioned evaporating section.</p> |
